Physical Design Automation Engineer

• Lead the development, deployment, and continuous improvement of RTL-to-GDS flows using Cadence Innovus as the primary PnR platform
• Define and drive physical design tools, flows, and methodologies including:

o Block-level implementation and integration o Floorplanning, placement, CTS, and routing automation o Timing closure methodologies

• Develop and maintain Tcl-based scripting and automation to enhance layout productivity within Innovus and related Cadence tools
• Evaluate and benchmark Cadence Innovus vs. Synopsys Fusion Compiler flows; provide data-driven recommendations on tool and methodology selection
• Enable and support industry-standard static timing analysis (STA) tools for test chips and Foundry IPs (FIPs), and ensure continued support and enhancement
• Collaborate with central CAD, design teams, local CAD teams, and EDA vendors (Cadence, Synopsys) to define next-generation PnR methodologies
• Work closely with internal and external design customers to understand requirements and deliver robust, scalable automation solutions
• Respond to customer/client requests proactively, developing solutions leveraging formal expertise and engineering judgment
• Contribute to process node bring-up by validating and refining flows on Intel's latest technology nodes

Qualifications

Educational Requirements Master's degree in M.Tech or MS in Microelectronics, Electronics Engineering, or an equivalent qualification from a reputed institute, with relevant industry experience in physical design and APR flow development Technical Qualifications Physical Design and APR Expertise Proven hands-on experience in block-level design closure using Cadence Innovus Implementation System as the primary APR tool for end-to-end RTL-to-GDS flows Strong working knowledge of all key physical design stages including Floorplanning covering die size estimation, macro placement and pin assignment, Power Planning covering power grid design, IR drop awareness, ring and stripe strategies, Placement covering timing-driven and congestion-aware placement optimization, Clock Tree Synthesis covering clock tree design, skew and latency optimization, and Routing covering global and detailed routing and DRC-clean routing closure Well-versed with multiple optimization techniques available in Cadence Innovus for achieving design closure, including timing, area, power, and congestion optimizations Ability to guide and mentor the team in resolving complex implementation challenges and providing structured solutions Timing and Constraints Strong understanding of digital timing concepts including setup, hold, clock domain crossing CDC, and multi-mode multi-corner MMMC analysis Ability to analyze and validate design constraints SDC and understand their impact on timing closure Experience with industry-standard STA tools such as Cadence Tempus or equivalent for timing sign-off Layout Closure and Sign-off Demonstrated experience in achieving full layout closure for blocks, ensuring compliance with DRC Design Rule Check, LVS Layout vs. Schematic, Density requirements and Antenna violation fixes Familiarity with physical verification tools and sign-off flows as per process technology specifications Top-Level Integration Good understanding of top-level integration challenges and ability to ensure block-level deliverables meet project-level requirements for both timing and layout closures Experience in managing block-to-top handoffs and resolving integration-level issues effectively Domain Knowledge Strong foundation in VLSI design, digital electronics, and semiconductor device fundamentals Good understanding of digital design timing closure principles and methodologies Knowledge of semiconductor fabrication and process technology will be a distinct added advantage Familiarity with Intel process technology or advanced node design environments is a plus Soft Skills and Behavioral Competencies Strong analytical and problem-solving skills with a structured approach to debugging complex physical design issues Proactive and transparent communication style with the ability to articulate technical challenges and solutions clearly to stakeholders Collaborative mindset with demonstrated ability to work effectively in a diverse, cross-functional, and geographically distributed team environment Ability to work across multiple domains including design, CAD, and EDA vendor teams Leadership and Experience Leadership experience in driving block-level closure and physical design sign-off for tape-out is strongly preferred Demonstrated track record of silicon success having contributed to or led designs that have been successfully taped out and validated in silicon is highly desirable

Job Type

Experienced Hire

Shift

Shift 1 (India)

Primary Location

India, Bangalore

Additional Locations

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust N/A

Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

• ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.